A procedure for determining the high-speed stencil printing performance of solder pastes in an electronic service provider's environmentGREENE, Christopher M; SRIHARI, Krishnaswami.Soldering & surface mount technology. 2008, Vol 20, Num 3, pp 26-33, issn 0954-0911, 8 p.Article

Assembly reliability assessment and life estimation for a stacked area array deviceIYER, Satyanarayan; SRIHARI, Krishnaswami.Microelectronics and reliability. 2010, Vol 50, Num 7, pp 978-985, issn 0026-2714, 8 p.Article

Reliable Lead-Free Rework Process for Stacked CSP ComponentsIYER, Satyanarayan; SRIHARI, Krishnaswami.IEEE transactions on electronics packaging manufacturing. 2009, Vol 32, Num 4, pp 214-220, issn 1521-334X, 7 p.Article

Implementing 0201s On High-Density Lead-Free Memory ModulesIYER, Satyanarayan; SAJJALA, Sandeep; DAMODARAN, Purushothaman et al.IEEE transactions on electronics packaging manufacturing. 2008, Vol 31, Num 1, pp 41-50, issn 1521-334X, 10 p.Article

Predicting performance measures for Markovian type of manufacturing systems with product failuresPRADHAN, Salil; DAMODARAN, Purushothaman; SRIHARI, Krishnaswami et al.European journal of operational research. 2007, Vol 184, Num 2, pp 725-744, issn 0377-2217, 20 p.Article

Developing a repeatable and reliable rework process for lead-free fine-pitch BGAsMANJUNATH, Deepak; IYER, Satyanarayan; DAMODARAN, Purushothaman et al.IEEE transactions on electronics packaging manufacturing. 2007, Vol 30, Num 4, pp 270-278, issn 1521-334X, 9 p.Article

Wave soldering using Sn/3.0Ag/0.5Cu solder and water soluble VOC-free fluxWABLE, Girish; QUYEN CHU; DAMODARAN, Purushothaman et al.IEEE transactions on electronics packaging manufacturing. 2006, Vol 29, Num 3, pp 202-210, issn 1521-334X, 9 p.Article

Rework of Lead-Free Area Array Packages Assembled on Ultrathin Flexible SubstratesCHENNAGIRI, Gurudutt; IYER, Satyanarayan Satya; SRIHARI, Krishnaswami Hari et al.IEEE transactions on components, packaging, and manufacturing technology (2011. Print). 2011, Vol 1, Num 3-4, pp 611-621, issn 2156-3950, 11 p.Article

Minimizing flux spatter during lead-free reflow assemblyMANJUNATH, Deepak; IYER, Satyanarayan; ECKEL, Shawn et al.Soldering & surface mount technology. 2006, Vol 18, Num 3, pp 19-23, issn 0954-0911, 5 p.Article

A systematic procedure for the selection of a lead-free solder paste in an electronics manufacturing environmentWABLE, Girish S; QUYEN CHU; DAMODARAN, Purushothaman et al.Soldering & surface mount technology. 2005, Vol 17, Num 2, pp 32-39, issn 0954-0911, 8 p.Article

A study of the CT Scan area of a healthcare providerRAMAKRISHNAN, Sreekanth; NAGARKAR, Kaustubh; DEGENNARO, Monice et al.Winter simulation conference. 2004, isbn 0-7803-8786-4, vol 2, part II, 2025-2031Conference Paper

Effects of assembly process variables on voiding at a thermal interfaceMUKADAM, Muffadal; SCHAKE, Jeff; BORGESEN, Peter et al.InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems. 2004, isbn 0-7803-8357-5, Vol1, 58-62Conference Paper